3216 (1206)3.2*1.6*1.6mm Ceramic Gas Discharge Tube SMD500XM Glass Discharge Tube
* Excellent response to fast rising transients
* Stable breakdown voltage
* GHz working frequency
* 8/20μs Impulse current capability: 500A
* Surface Mount package
* Non-Radioactive
* Ultra Low capacitance(<0.3pF) and insertion loss
* Lead-free compliant
* RoHS and REACH compliant
* Very Small Size(EIA 1206)
* Storage and operational temperature: -40~+90°C
Application Of The SMD Ceramic Gas Discharge Tube 3216 500V 500A
* Ethernet, PoE, xDSL
* Cable modem, splitters, line cards
* Wireless antenna protection
* CATV equipment
* SPD
* Switching power supply
Specification Of The SMD Ceramic Gas Discharge Tube 3216 500V 500A
a. Reference executive standard: ITU-TK12 Gbt9043-2008general Technical Requirements of Gas Discharge Tubes for the
b. Over-voltage protection of telecommunications installations
c. The maximum AC withstand current (50 Hz )is 1A and AC voltage shall be larger than the upper limit value of DC spark-over voltage during the test.
d. The electrode capacitance test frequency is 1MHZ and test voltage is 0. 5V
e. Operating and Storage temperature -40C~+85C
f. Packaging: Automaton taped 2500PCS per reel, 50000PCS per carton
| Catalog No. | DC Spark Over Voltage (100v/s)V | Impulse Spark Over Voltage (1kv/μs)V | Insulation Resistance MΩ | Electrode Capacitance 1MHz 0.5V PF | Impulse Discharge Current (8/20μs 10times) | AC Discharge Current (50Hz 1s 10times)A |
| 3DS090H | 090±30% | ≤900 | ≥100 | ≤1 | 0.5KA | 1A |
| 3DS150H | 150±30% | ≤1100 | ≥100 | ≤1 | 0.5KA | 1A |
| 3DS200H | 200±30% | ≤1100 | ≥100 | ≤1 | 0.5KA | 1A |
| 3DS300H | 300±30% | ≤1200 | ≥100 | ≤1 | 0.5KA | 1A |
| 3DS400H | 400±30% | ≤1300 | ≥100 | ≤1 | 0.5KA | 1A |
| 3DS500H | 500±30% | ≤1300 | ≥100 | ≤1 | 0.5KA | 1A |
Size Of The SMD Ceramic Gas Discharge Tube 3216 500V 500A (mm)
3216 (1206)3.2*1.6*1.6mm Ceramic Gas Discharge Tube SMD500XM Glass Discharge Tube
• 10+ years of designing and manufacturing GDT devices
• Impulse current ratings (2 kA to 100 kA)
• Low capacitance and insertion loss
• Designs based on industry standards
• Switch-Grade Fail-Short technology available on some models
• Technical committee participation and leadership
• Custom device capabilities
• Lab facilities available for design verification of customer circuits as well as with testing capabilities for UL and Telcordia standards
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Surface mounted components (SMD) may exhibit a temporary increase in the DC spark-over voltage after the solder reflow process.The components will recover within 24 hours. There is no quality defect nor change in protection levels during the temporary change in DC spark-over voltage.
The SMD3216 series has been especially designed to meet data transmission protection requirements. The optimized design features a high level of protection against fast rising transients usually caused by lightning disturbances. For use in high frequency data lines, the series offers ultra low capacitances and shows only marginally signal losses up to high frequencies. The devices are extremely reliable and are able to withstand high surge currents without destruction.
